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Sale

Flip Chip Technologies

by John H. Lau
$19.90 Now $13.90 Save 30%
Compare to estimated retail price: S$137.61  

The item you've got your eye on is secondhand. You probably already know that, but just in case!

The estimated retail price shown next to any listed item represents the first-hand prices we've seen elsewhere, or the estimated original retail price of a comparable item of the same quality, construction and material offered elsewhere in new condition.

Flip Chip Technologies - Thryft
Flip Chip Technologies - Thryft

Revolutionary flip chips without wires – FCT

Flip Chip Technologies could be a great read for electronic engineers and designers who are interested in exploring the techniques to facilitate chip connections without the use of wires. The book offers a comprehensive overview of the major design, material, and manufacturing issues related to FCT, making it a valuable resource for anyone interested in this topic. The book is written by authoritative contributors who are experts in the field, ensuring that the content is well-researched and informative. Overall, Flip Chip Technologies is an excellent read for those who want to stay up to date on the latest and most efficient technologies in the electronics industry.

Note: While we do our best to ensure the accuracy of cover images, ISBNs may at times be reused for different editions of the same title which may hence appear as a different cover.
Sale

Flip Chip Technologies

by John H. Lau
$19.90 Now $13.90 Save 30%
Compare to estimated retail price: S$137.61  

The item you've got your eye on is secondhand. You probably already know that, but just in case!

The estimated retail price shown next to any listed item represents the first-hand prices we've seen elsewhere, or the estimated original retail price of a comparable item of the same quality, construction and material offered elsewhere in new condition.

Condition guide

Book Condition Guide

Books in Like New Condition

This book may contain very minor cosmetic defects, but it is in pristine condition. There should be no yellowing, no foxing, no water damage, and no annotations of any kind on the cover and the pages. For paperbacks, there should not be any crease marks on the spine. This book is good as new — lucky you!

*Books may be missing bundle media (e.g. CD, e-book code), if included.

Books in Very Good Condition

This book has been used, but it is still in a clean condition. There should be no foxing or annotations of any kind on the inner pages, but a sparse amount may be present on the cover, title pages, or outside edges of the book. There should be no water damage of any kind. For paperbacks, there may be light crease marks on the spine.

*Books may be missing bundle media (e.g. CD, e-book code), if included.

Books in Good Condition

We do our best to ensure the quality of our books, but there is no escaping the wear and tear that comes with time. Slight foxing and some annotations may be present on the pages and the cover. There should be no water damage of any kind. For paperbacks, there may be several crease marks on the spine.

*Books may be missing bundle media (e.g. CD, e-book code), if included.

Books in Well Read Condition

This is a well-read book, which means that the previous owner probably really enjoyed it! The cover and pages may include moderate foxing and annotations, but the text is not obscured and still readable. Moderate cosmetic defects and minor water damage may be present on the edges of the book. For paperbacks, there may be multiple crease marks on the spine.

*Books may be missing bundle media (e.g. CD, e-book code), if included.

 

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Sale: Buy 2 Get 1 Free

Add any 3 preloved items to your cart and use code B2G1F at checkout. Ends 12/7/26 11:59PM SGT.

ISBN: 9780070366091
Authors: John H. Lau
Publisher: McGraw-Hill Professional
Date of Publication: 1995-12-01
Format: Hardcover
Related Collections: Science, Business
Related Topics: Technology, Computers
Goodreads rating: 4.0
(rated by 1 readers)

Description

A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation c. by Book News, Inc., Portland, Or.
 

Revolutionary flip chips without wires – FCT

Flip Chip Technologies could be a great read for electronic engineers and designers who are interested in exploring the techniques to facilitate chip connections without the use of wires. The book offers a comprehensive overview of the major design, material, and manufacturing issues related to FCT, making it a valuable resource for anyone interested in this topic. The book is written by authoritative contributors who are experts in the field, ensuring that the content is well-researched and informative. Overall, Flip Chip Technologies is an excellent read for those who want to stay up to date on the latest and most efficient technologies in the electronics industry.

Note: While we do our best to ensure the accuracy of cover images, ISBNs may at times be reused for different editions of the same title which may hence appear as a different cover.